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Home > Technology > Electronics > High-Speed VLSI Interconnections-eBook
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High-Speed VLSI Interconnections
 
 
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This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections

In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.

Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:
*

Preliminary Concepts
*

Parasitic Resistances, Capacitances, and Inductances
*

Interconnection Delays
*

Crosstalk Analysis
*

Electromigration-Induced Failure Analysis
*

Future Interconnections

High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
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Title of ebook: High-Speed VLSI Interconnections
ISBN: 9780470165966
Publisher: Wiley-Interscience
Internet download file size: 9437 kb
Pages: 432
Released online for download: 10-16-2007
Author of eBook: Goel, Ashok K.


High-Speed VLSI Interconnections



Chapter One

Preliminary Concepts and More

In this chapter, some of the basic concepts and techniques used in this book are presented. The chapter is organized as follows:

Various types of interconnections employed in very large scale integration (VLSI) applications are discussed in Section 1.1.

Advantages and challenges posed by the copper interconnections and the techniques used for their fabrication are presented in Section 1.2.

Method of images used to find the Green's function matrix in Chapter 2 is presented in Section 1.3.

Method of moments used to determine the various interconnection capacitances in Chapter 2 is discussed in Section 1.4.

Even- and odd-mode capacitances for two and three coupled conductors are discussed in Section 1.5.

Transmission line equations are derived and coupled tran ... read full excerpt from High-Speed VLSI Interconnections ebook





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