Microvias: Low Cost, High Density Interconnects ebook Lau, John H. Diesel eBooks

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Home > Technology > Electronics > Microvias: Low Cost, High Density Interconnects-eBook

Microvias: Low Cost, High Density Interconnects

Lau, John H.

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Microvias: Low Cost, High Density Interconnects

State-of-the-art introduction to high-density interconnect technology

The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that's changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee's intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.

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Title of ebook: Microvias: Low Cost, High Density Interconnects
ISBN: 9780071382991
Publisher: McGraw-Hill
Internet download file size: 7155 kb
Pages: 550
Released online for download: 04-30-2001
Author of eBook: Lau, John H.
Joint Author: Lee, Ricky S.